There are two types of SOI (Silicon On Insulator) wafers. Thin film SOI wafers have a device layer <1.5 μm and thick film wafers have a device layer >1.5 μm. SOI wafers are produced by using ion implantation and wafer bonding technology.

ZnO crystal is one of the most suitable substrate for use in wide band gap semiconductor applications. ZnO wafer have been widely used for the growth of nitride based devices.

Sapphire is Aluminium Oxide in purest form with no porosity or grain boundaries, making it theoretically dense. A suitable material for high performance system and component designs.

Borofloat Glass is highly chemically resistant Borosilicate glass with low thermal expansion that is produced using the float method. Other key properties of Borofloat are its mirror like surface quality, high thermal resistance, and excellent transmission.

Pyrex® 7740 is a low expansion borosilicate glass. Because of its low coefficient of thermal expansion, the material is useful in high temperature applications, and is also heat shock resistant. Pyrex is also resistant to acid and has high optical transmission over a wide wavelength range.